Teradek Cube/Slice/Bond 700 Series firmware v8.2.26

Teradek · Released Jan 6, 2025 · First seen Jul 11, 2026

v8.2.26 is the latest firmware for the Teradek Cube/Slice/Bond 700 Series, released January 6, 2025.

What's in this update

Teradek Firmware Version 8.2.26

New Features

  • None

Changes and

Improvements

  • Removed On D​emand option from Core server selections
  • Removed invalid Groups publish setting from Fac​ebook API request

Bug Fixes

  • Fixed web UI login issue when using FQDN over a routed VLAN
  • Date stamp was unnecessarily added to Canon clipnames

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Other versions for this product

See the full firmware history for the Cube/Slice/Bond 700 Series